AG16KSDE176

AG16KSDE176是由AGM FPGA AG16K与SDRAM叠封集成的芯片，具有AG16K FPGA的可编程功能，提供更多可编程IO，同时内部连接大容量SDRAM。

Features

● High-density architecture with 16K LEs

● M9K embedded memory blocks, up to 504Kbits of RAM space

● Up to 56 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit

multipliers

● Provides 4 PLLs per device provide clock multiplication and phase shifting

● High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

● Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

● General package options, LQFP176.

● Flexible device configuration mode: JTAG and AS, PS

● Support remote update, by "dual-boot" like implementation